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MEMS packaging packaging factories met the challenge of how
Source:wynaik Time:2015-12-09
MEMS and sensor devices have been widely penetrated into our daily lives, from the smart phone to the car and so on the field MEMS can be said to have been everywhere. And the application of MEMS is becoming more and more diverse, and each application has its own special requirements, especially when it comes to the application of pressure sensor, gas, temperature and humidity. Because the MEMS and sensor technology has gone beyond the automotive application in consumer electronics and mobile devices, packaging and foundry (OSAT) has been in search of other more cost-effective packaging solutions for customers, such as OSAT and material suppliers to jointly develop the special materials used for chip bonding and mould filling, to provide more solutions the cost advantage and the area of high efficiency. This trend first affects the main inertial devices, but now there are many optical and environmental applications are springing up, and look forward to the product in the small volume, low cost, high performance of the three aspects of progress.

The original MEMS and sensor IDM is still in a very strong position. But as many new members enter the market, and the fabless mode brings the concept of product innovation, it drives the OSAT vendors to innovate to serve the complex customer customization requirements, but at the same time, OSAT also try to maintain some common features among different platforms. IDM also encountered challenges, mainly due to the investment in a variety of packaging solutions, but also in product innovation and time to market to remain ahead is very difficult. Some IDM is increasingly dependent on OSAT partners, MEMS packaging for the automotive and industrial sectors are still in the interior, and the consumer electronics MEMS package to OSAT.
Today, the hype around the Internet of things is growing, and the reality is that, on the MEMS and sensor packages, the complex challenges still behind. The design engineer has been seeking better software, better connectivity, and sophisticated hardware, the hardware is becoming a key solution, the price, packaging and power requirements more stringent. Devices can be worn in addition to stringent power consumption and price requirements, but also requires a significant drop in the device thickness. However, the main challenge is not the encapsulation of MEMS and sensor itself; rather, OSAT needs to provide the most suitable architecture to achieve the most suitable architecture to implement the module and / or SiP integration. Will the future MEMS and sensor solutions be encapsulated in SiP? Is still MEMS and the sensor is integrated in a package? The strength of the IDM manufacturers have the ability to provide most of the components of its system applications, they have their own internal strategy; however, for other manufacturers, MEMS packaging will become crucial. Currently available on the market of smart module solutions, size and power consumption is possible to achieve a substantial reduction, especially if the system, device and packaging manufacturers in the early stages of product development cooperation.

With the overall needs of the advanced features of the device, the operating direction of OSAT should be a variety of packaging solutions, and from the following aspects to meet the needs of customers:

Performance (Electrical and Mechanical)

System integration

Time to market
- cost

With the increasing size of the package, the use of silicon via hole (TSV) 3D wafer level packaging (3DWLP) is absolutely an intelligent integration of more MEMS and sensor solutions. 3D wafer level packaging is becoming wearable and medical devices must have the technology; and for smart home, industrial market intelligence devices may be more dependent on the classic platform - but this does not mean that they do not face challenges. Because of this, OSAT is trying to provide a common intelligent system integration key building blocks, regardless of its system is what kind of application.

Medical applications will no doubt increase significantly in the MEMS industry. Although many applications have been pushed to the market, in reality we see only the tip of the iceberg. Not only professional health care workers will further use of advanced technology to provide health care service level, the whole society will more and more in the daily life to track human health. MEMS will play the most important role in all of these applications. Sensors in the bio medical field can be divided into four major types: biological sensors, biological MEMS diagnostics (disposable or portable), MEMS for skin or portable devices (treatment tracking, etc.), and MEMS. The first category (bio sensors) is now being widely deployed in numerous products, in particular the fitness bracelet, smart watches and smart phones, to track multiple vital signs and activities. The following figure is a typical small module integrated in the smart phone can monitor up to six vital signs of life. Combine advanced packaging technology, and now can be optical sensors, mechanical sensors, MEMS and passive devices with a variety of IC circuits, integrated into the smart phone or wearable devices.

Diagnostic applications will benefit from the development of bio sensors, but now one of the main obstacles is the microfluidic chip, which is often necessary for such devices, but also the short board.

There are still many difficulties in the future of the intake of equipment or implantable devices. Bio compatibility, self powered and very high reliability (especially implant) are key elements. Now, some small and scattered equipment available, but we still very far from the large-scale deployment.

Whatever the future application of the platform, MEMSThe future of the industry is bright. A series of programs based on MEMS devices will continue to play an important role in consumer devices, medical equipment and automotive applications. While the overall market growth is hard to say, it is obvious that the demand for the solution is increasing year by year. The intelligent module and SiP integration is the key, which will make the connection the equipment deployment possible reckon. To do this, a simplified supply chain and collaboration among participants in the supply chain are important.

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